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UNL-PxPhI-SOP-209-tmpl.txt
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UNL-PxPhI-SOP-209-tmpl.txt
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Testing of HDI for wirebondability
----------------------------------
Procedure performed according to SOP 209-v0
Date : ___________
Time start : _____ end: _____
Operator name : _______________
Wire batch no. : ______________ Expiration date: ______________
Wirebonder checked for wire feed [ ] Yes [ ] No (Report deviations in comments)
Bond parameters used - Set: ___
US time (ms) : ___
B-Force (cN) : ___
US power (digit): ___
TD steps (µm) : ___
Loop parameters used:
Z-Presign (%): ___
LoopH-Fct (%): ___
XYLoopHeightFct (%): ___
Z-Delay (%): ___
List id of parts and pad areas used in table below:
HDI Id. | ROC pad | Height | Missed | Pull strength | Special observations (observed damages, missed bonds etc.)
| | | bonds | average | sigma | min | max |
----------------------+---------+--------+--------+-------------------------------+-----------------------------------------------------------
| | | | |
| | | | |
| | | | |
| | | | |
| | | | |
| | | | |
| | | | |
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| | | | |
Total number of ROC pads bonded and tested: ____
Special observations:
Comments: